© 2010 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN256 • Rev. 1.0.0

8

Physical Dimensions

Figure 14. 8-Lead, MicroPak™ 1.6mm Wide

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the

warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

Tape and Reel Specifications

Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:

(0.09)

(0.1)

(0.2)

1.6

2X

0.05

0.00

1.6

2X

C

4

3. DRAWING CONFORMS TO ASME Y.14M-1994

2. DIMENSIONS ARE IN MILLIMETERS

1. PACKAGE CONFORMS TO JEDEC MO-255 VARIATION UAAD

BOTTOM VIEW

4. PIN 1 FLAG, END OF PACKAGE OFFSET

MAC08AREV4

1

23

5

6

7

8

Notes:

8X 0.25

0.35

3X

8X

1.0

4

0.5

8X

0.25

0.15

0.10

CA B

0.05

C

TOP VIEW

INDEX AREA

B

Recommended Landpattern

A

0.55 MAX

DETAIL A

0.35

0.25

(0.15)

(0.20)

0.35

0.25

DETAIL A

PIN #1 TERMINAL

SCALE: 2X

5. DRAWING FILE NAME: MKT-MAC08AREV4