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CXK582000TM-10LL Datasheet(PDF) 10 Page - Sony Corporation |
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CXK582000TM-10LL Datasheet(HTML) 10 Page - Sony Corporation |
10 / 11 page – 10 – CXK582000TM/YM/M Package Outline Unit: mm SONY CODE EIAJ CODE JEDEC CODE TSOP-32P-L01 TSOP032-P-0820-A PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT 42 ALLOY SOLDER PLATING EPOXY / PHENOL RESIN 0° to 10° 32PIN TSOP (I) (PLASTIC) 8.0 ± 0.2 32 17 0.2 – 0.03 + 0.08 0.5 NOTE : ∗NOT INCLUDE MOLD FINS. 116 A 0.127 – 0.02 + 0.05 0.1 ± 0.1 1.07 – 0.1 + 0.2 DETAIL A 0.1 0.08 M CXK582000YM SONY CODE EIAJ CODE JEDEC CODE PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY RESIN SOLDER PLATING 42 ALLOY TSOP-32P-L01R TSOP032-P-0820-B 32PIN TSOP (PLASTIC) M 0.08 0.5 0.2 – 0.03 + 0.08 16 1 17 32 8.0 ± 0.2 1.07 – 0.1 + 0.2 0.127 – 0.02 + 0.05 0.1 ± 0.1 0° to 10° A 0.1 DETAIL A 0.3g NOTE > Dimension “ ∗” does not include mold protrusion. CXK582000TM |
Número de pieza similar - CXK582000TM-10LL |
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Descripción similar - CXK582000TM-10LL |
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