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CXL5512P Datasheet(PDF) 9 Page - Sony Corporation |
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CXL5512P Datasheet(HTML) 9 Page - Sony Corporation |
9 / 9 page M PACKAGE STRUCTURE MOLDING COMPOUND LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY / PHENOL RESIN SOLDER PLATING 42 ALLOY 85 1 4 1.27 0.4 – 0.05 + 0.1 ± 0.12 0° to 10° 1.25 – 0.15 + 0.4 0.15 – 0.05 + 0.1 0.10 A 0.1 – 0.1 + 0.15 5.0 – 0.1 + 0.4 0.1g SOP-8P-L03 ∗SOP008-P-0225-A 8PIN SOP (PLASTIC) DETAILA SONY CODE EIAJ CODE JEDEC CODE SONY CODE EIAJ CODE JEDEC CODE PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY RESIN SOLDER PLATING COPPER ALLOY 8PIN DIP (PLASTIC) 300mil 9.4 – 0.1 + 0.4 2.54 1 4 5 8 1.2 ± 0.15 0.5 ± 0.1 0° to 15° 0.5g DIP-8P-01 ∗DIP008-P-0300-A Package Outline Unit : mm CXL5512M CXL5512P CXL5512M/P —9— |
Número de pieza similar - CXL5512P |
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Descripción similar - CXL5512P |
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