AD1315

–3–

REV. A

ABSOLUTE MAXIMUM RATINGS

1

Power Supply Voltage

Inputs

Difference from INH to

INH . . . . . . . . . . . . . . . . . . . . . 5 V

INH,

INH . . . . . . . . . . . . . . . . . . +V

Operating Temperature Range . . . . . . . . . . . . . . . 0 to +70

°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +125°C

Lead Temperature Range (Soldering 20 sec)

2

. . . . . . . +300

°C

Pin

No.

Symbol

Function

Logic Low Current Return

Communication Voltage

Load/Dot Connection

Negative Supply

Logic High Current Return

Logic Low Current Program Voltage

7

LID

Lid Connection (Internal)

8

GND

Ground

Logic High Current Program Voltage

10

N/C

No Connection

11

N/C

No Connection

12

N/C

No Connection

13

Positive Supply

14

INH

Inhibit

15

INH

Inhibit

16

N/C

No Connection

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

±0.002 inches) and solderability, handling with bare

hands should be avoided and the device should be stored in an environment at

24

°C, ± 5°C (75°F, ±10°F) with relative humidity not to exceed 65%.

CONNECTION DIAGRAM

SUGGESTED PAD LOCATION

Dimensions shown in inches and (mm).

ORDERING GUIDE

Temperature

Package

Package

Model

Range

Description

Option*

AD1315KZ

0 to +70

°C

16-Lead Gull Wing

Z-16B

*Z = Leaded Chip Carrier (Ceramic).