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TC1101V Datasheet(PDF) 2 Page - Transcom, Inc. |
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TC1101V Datasheet(HTML) 2 Page - Transcom, Inc. |
2 / 2 page TC1101V REV6_20070502 TRANSCOM, INC., 90 Dasoong 7 th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 2/2 CHIP DIMENSIONS Units: Micrometers Chip Thickness: 55 Gate Pad: 55 x 50 Drain Pad: 55 x 50 Source Pad: 55 x 60 CHIP HANDLING DIE ATTACHMENT : Conductive epoxy or eutectic die attach is recommended. For eutectic die attach can be accomplished with Au-Sn (80%Au-20%Sn) perform in State Temperature : 290°C ±5°C ; Handling Tool : Tweezers ; Time : less than 1min . WIRE BONDING : The recommended wire bond method is thermocompression bonding with 0.7 or 1.0 mil (0.018 or 0.025mm) gold wire. State Temperature : 220°C to 250°C ; Bond Tip Temperature : 150°C ; Bond Force : 20 to 30 gms depending on size of wire and Bond Tip Temperature. HANDLING PRECAUTIONS : The user must operate in a clean, dry environment. Care should be exercised during handling avoid damage to the devices. Electrostatic Discharge(ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. The static discharge must less than 300V. G D S S 290 6 12 250 6 12 |
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