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TC1201 Datasheet(PDF) 6 Page - Transcom, Inc.

No. de pieza TC1201
Descripción Electrónicos  Low Noise and Medium Power GaAs FETs
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Fabricante Electrónico  TRANSCOM [Transcom, Inc.]
Página de inicio  http://www.transcominc.com.tw
Logo TRANSCOM - Transcom, Inc.

TC1201 Datasheet(HTML) 6 Page - Transcom, Inc.

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TC1201
REV5_20070502
TRANSCOM, INC., 90 Dasoong 7
th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
6 / 6
SCHEMATIC
TOM2 MODEL PARAMETERS
Parameters
Parameters
VTO
-0.757 V
VMAX
0.5
V
ALPHA
3.92
CGD
0.032 pF
BETA
0.161
CGS
1.7929 pF
GAMMA
0.0509
CDS
0.097 pF
DELTA
0.3815
RIS
7.121 Ohm
Q
0.987
RID
0.001 Ohm
NG
0.1
VBR
9
V
ND
0.01
RDB
173.9 Ohm
TAU
5.098 ps
CBS
0.0266 pF
RG
2.205 Ohm TNOM
25
°C
RD
0.898 Ohm LS
0.0005 nH
RS
1.631 Ohm LG
0.0278 nH
IS
1E-11 mA
LD
0.0243 nH
N
1
AFAC
1
VBI
1
V
NFING
1
VDELTA
0.2
V
CHIP HANDLING
DIE ATTACHMENT: Conductive epoxy or eutectic die attach is recommended. Eutectic die attach can be
accomplished with Au-Sn (80%Au-20%Sn) perform at stage temperature: 290°C ± 5°C; Handling Tool: Tweezers;
Time: less than 1min.
WIRE BONDING: The recommended wire bond method is thermocompression bonding with 0.7 to 1.0 mil
(0.018 to 0.025 mm) gold wire. Stage temperature: 220°C to 250°C; Bond Tip Temperature: 150°C; Bond Force:
20 to 30 gms depending on size of wire and Bond Tip Temperature.
HANDLING PRECAUTIONS: The user must operate in a clean, dry environment. Care should be exercised
during handling avoid damage to the devices. Electrostatic Discharge (ESD) precautions should be observed at all
stages of storage, handling, assembly, and testing. The static discharge must be less than 300V.
Cgs
Cgd
Cds
Rg
Rd
Rdb
Ris
Rs
Id
Lg
Ld
Ls
Cbs
Rid


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