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TC1201V Datasheet(PDF) 2 Page - Transcom, Inc. |
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TC1201V Datasheet(HTML) 2 Page - Transcom, Inc. |
2 / 2 page TC1201V REV5_20070502 TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C. Web-Site: www.transcominc.com.tw Phone: 886-6-5050086 Fax: 886-6-5051602 2 / 2 ABSOLUTE MAXIMUM RATINGS (TA=25 °°°°C) TYPICAL NOISE PARAMETERS (TA=25 °°°°C) VDS = 4 V, IDS = 25 mA Symbol Parameter Rating VDS Drain-Source Voltage 7.0 V VGS Gate-Source Voltage -3.0 V IDS Drain Current IDSS IGS Gate Current 300 µA Pin RF Input Power, CW 21 dBm PT Continuous Dissipation 400 mW TCH Channel Temperature 175 °C TSTG Storage Temperature - 65 °C to +175 °C Γopt Frequency (GHz) NFopt (dB) GA (dB) MAG ANG Rn/50 2 0.36 20.2 0.96 14 0.59 4 0.38 18.5 0.83 31 0.50 6 0.40 16.7 0.67 51 0.39 8 0.43 15.2 0.51 76 0.28 10 0.50 13.8 0.37 108 0.17 12 0.56 12.7 0.28 147 0.13 14 0.66 12.1 0.25 -166 0.11 16 0.83 12.0 0.31 -108 0.15 18 1.03 12.2 0.49 -41 0.34 CHIP DIMENSIONS Units: Micrometers Chip Thickness: 55 Gate Pad: 55 x 50 Drain Pad: 55 x 50 Source Pad: 55 x 65 CHIP HANDLING DIE ATTACHMENT : Conductive epoxy or eutectic die attach is recommended. For eutectic die attach can be accomplished with Au-Sn (80%Au-20%Sn) perform in State Temperature : 290 °C ±5°C ; Handling Tool : Tweezers ; Time : less than 1min . WIRE BONDING : The recommended wire bond method is thermo-compression bonding with 0.7 or 1.0 mil (0.018 or 0.025mm) gold wire. State Temperature : 220 °C to 250°C ; Bond Tip Temperature : 150°C ; Bond Force : 20 to 30 gms depending on size of wire and Bond Tip Temperature. HANDLING PRECAUTIONS : The user must operate in a clean, dry environment. Care should be exercised during handling avoid damage to the devices. Electrostatic Discharge(ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. The static discharge must less than 300V. D S S G D S G 430 ! 12 250!12 |
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