AD630S datasheet(2/8 Pages) AD

No. de pieza	AD630S

Descripción Electrónicos	Balanced Modulator/Demodulator

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Fabricante Electrónico	AD [Analog Devices]

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AD630–SPECIFICATIONS

REV. C

–2–

ORDERING GUIDE

Temperature

Package

Model

Ranges

Descriptions

Options

AD630JN

0

°C to +70°C

Plastic DIP

N-20

AD630KN

0

°C to +70°C

Plastic DIP

N-20

AD630AD

–25

°C to +85°C Side Brazed DIP D-20

AD630BD

–25

°C to +85°C Side Brazed DIP D-20

AD630SD

–55

°C to +125°C Side Brazed DIP D-20

AD630SD/883B

–55

°C to +125°C Side Brazed DIP D-20

5962-8980701RA –55

°C to +125°C Side Brazed DIP D-20

AD630SE/883B

–55

°C to +125°C LCC

E-20A

5962-89807012A –55

°C to +125°C LCC

E-20A

AD630JCHIPS

0

°C to +70°C

Chip

AD630SCHIPS

–55

°C to +125°C Chip

(@ + 25 C and

VS =

15 V unless otherwise noted)

Model

AD630J/A

AD630K/B

AD630S

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

Unit

GAIN

Open Loop Gain

90

110

100

120

90

110

dB

±1, ±2 Closed Loop Gain Error

0.1

0.05

0.1

%

Closed Loop Gain Match

0.1

0.05

0.1

%

Closed Loop Gain Drift

2

ppm/

°C

CHANNEL INPUTS

VIN Operational Limit

1

(–VS + 4 V) to (+VS – 1 V)

Volts

Input Offset Voltage

500

100

500

µV

Input Offset Voltage

TMIN to TMAX

800

160

1000

µV

Input Bias Current

100

300

100

300

100

300

nA

Input Offset Current

10

50

10

50

10

50

nA

Channel Separation @ 10 kHz

100

dB

COMPARATOR

VIN Operational Limit

1

(–VS + 3 V) to (+VS – 1.5 V)

(–VS + 3 V) to (+VS – 1.3 V)

Volts

Switching Window

1.5

mV

Switching Window

TMIN to TMAX

2

2.0

2.5

mV

Input Bias Current

100

300

100

300

100

300

nA

Response Time (–5 mV to +5 mV Step)

200

ns

Channel Status

ISINK @ VOL = –VS + 0.4 V

3

1.6

mA

Pull-Up Voltage

(–VS + 33 V)

Volts

DYNAMIC PERFORMANCE

Unity Gain Bandwidth

2

MHz

Slew Rate4

45

V/

µs

Settling Time to 0.1% (20 V Step)

3

µs

OPERATING CHARACTERISTICS

Common-Mode Rejection

85

105

90

110

90

110

dB

Power Supply Rejection

90

110

90

110

90

110

dB

Supply Voltage Range

5

±16.5

5

±16.5

5

±16.5

Volts

Supply Current

4

5

4

5

4

5

mA

OUTPUT VOLTAGE, @ RL = 2 k

Ω

TMIN to TMAX

2

10

±10

Volts

Output Short Circuit Current

25

mA

TEMPERATURE RANGES

Rated Performance–N Package

0

+70

0

+70

N/A

°C

Rated Performance–D Package

–25

+85

–25

+85

–55

+125

°C

NOTES

1If one terminal of each differential channel or comparator input is kept within these limits the other terminal may be taken to the positive supply.

2These parameters are guaranteed but not tested for J and K grades. For A, B and S grades they are tested.

3I

SINK @ VOL = (–VS + 1) volt is typically 4 mA.

4Pin 12 Open. Slew rate with Pins 12 and 13 shorted is typically 35 V/

µs.

Specifications subject to change without notice.

Specifications shown in boldface are tested on all production units at final electrical test. Results from those tests are used to calculate outgoing quality levels. All min

and max specifications are guaranteed, although only those shown in boldface are tested on all production units.

ABSOLUTE MAXIMUM RATINGS

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±18 V

Internal Power Dissipation . . . . . . . . . . . . . . . . . . . . . 600 mW

Output Short Circuit to Ground . . . . . . . . . . . . . . . . Indefinite

Storage Temperature, Ceramic Package . . . . –65

°C to +150°C

Storage Temperature, Plastic Package . . . . . . –55

°C to +125°C

Lead Temperature Range (Soldering, 10 sec ) . . . . . . . +300

°C

Max Junction Temperature . . . . . . . . . . . . . . . . . . . . . +150

°C

THERMAL CHARACTERISTICS

θ

JC

θ

JA

20-Pin Plastic DIP (N)

24

°C/W

61

°C/W

20-Pin Ceramic DIP (D)

35

°C/W

120

°C/W

20-Pin Leadless Chip Carrier (E)

35

°C/W

120

°C/W

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