AD73322AR datasheet(10/43 Pages) AD

No. de pieza	AD73322AR

Descripción Electrónicos	Low Cost, Low Power CMOS General-Purpose Dual Analog Front End

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Fabricante Electrónico	AD [Analog Devices]

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AD73322

–10–

REV. B

ABSOLUTE MAXIMUM RATINGS*

(TA = +25°C unless otherwise noted)

AVDD, DVDD to GND . . . . . . . . . . . . . . . . . –0.3 V to +7 V

AGND to DGND . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V

Digital I/O Voltage to DGND . . . . . –0.3 V to DVDD + 0.3 V

Analog I/O Voltage to AGND . . . . . –0.3 V to AVDD + 0.3 V

Operating Temperature Range

Industrial (A Version) . . . . . . . . . . . . . . .

–40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Maximum Junction Temperature . . . . . . . . . . . . . . . +150

°C

SOIC,

θ

JA Thermal Impedance

. . . . . . . . . . . . . . . 71.4

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

LQFP,

θ

JA Thermal Impedance . . . . . . . . . . . . . . .

53.2

°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

ORDERING GUIDE

Temperature

Package

Model

Range

Descriptions

Options

AD73322AR

–40

°C to +85°C

Wide Body SOIC

R-28

AD73322AST

–40

°C to +85°C

Plastic Thin Quad ST-44A

Flatpack (LQFP)

EVAL-AD73322EB

Evaluation Board

1

+EZ-KIT Lite Upgrade

2

EVAL-AD73322EZ

Evaluation Board

1

+EZ-KIT Lite

3

NOTES

1The AD73322 evaluation board features a selectable number of codecs in

cascade (from 1 to 4). It can be interfaced to an ADSP-2181 EZ-KIT Lite or to

a Texas Instruments EVM kit.

2The upgrade consists of a connector that is used to connect the EZ-KIT to the

AD73322 evaluation board. This option is intended for owners of the EZ-KIT

Lite.

3The EZ-KIT Lite has been modified to allow it to interface with the AD73322

evaluation board. This option is intended for users who do not already have an

EZ-KIT Lite.

PIN CONFIGURATIONS

28-Lead Wide Body SOIC

(R-28)

TOP VIEW

(Not to Scale)

28

27

26

25

24

23

22

21

20

19

18

17

16

15

1

2

3

4

5

6

7

8

9

10

11

12

13

14

AD73322

SDO

MCLK

SCLK

RESET

DVDD

DGND

AGND2

VINP1

VFBP1

VINN1

VFBN1

AVDD2

REFCAP

REFOUT

SDOFS

SDIFS

SDI

SE

AGND1

AVDD1

VOUTP2

VFBN2

VINN2

VFBP2

VINP2

VOUTN2

VOUTP1

VOUTN1

44-Lead Plastic Thin Quad Flatpack (LQFP)

(ST-44A)

3

4

5

6

7

1

2

10

11

8

9

40 39 38

41

42

43

44

36 35 34

37

29

30

31

32

33

27

28

25

26

23

24

PIN 1

IDENTIFIER

TOP VIEW

(Not to Scale)

12 13

14 15 16 17 18 19 20 21 22

NC

VOUTN1

VOUTP1

NC

VOUTN2

VOUTP2

NC

AD73322

REFOUT

REFCAP

AVDD2

AGND2

NC = NO CONNECT

AGND2

DGND

DVDD

AVDD1

AGND1

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