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TLC274IDG4 Datasheet(PDF) 4 Page - Texas Instruments |
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TLC274IDG4 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 53 page TLC274, TLC274A, TLC274B, TLC274Y, TLC279 LinCMOS PRECISION QUAD OPERATIONAL AMPLIFIERS SLOS092D − SEPTEMBER 1987 − REVISED MARCH 2001 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLC274Y chip information These chips, when properly assembled, display characteristics similar to the TLC274C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (11) IS INTERNALLY CONNECTED TO BACK SIDE OF CHIP. + − 1OUT 1IN + 1IN − VDD (4) (6) (3) (2) (5) (1) − + (7) 2IN + 2IN − 2OUT 11 GND + − 3OUT 3IN + 3IN − (13) (10) (9) (12) (8) − + (14) 4OUT 4IN + 4IN − 68 108 (1) (2) (3) (4) (5) (6) (7) (8) (9) (10) (11) (12) (13) (14) |
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