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744325550 Datasheet(PDF) 5 Page - Analog Devices |
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744325550 Datasheet(HTML) 5 Page - Analog Devices |
5 / 24 page Data Sheet ADP2384 Rev. 0 | Page 5 of 24 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating PVIN, EN, PGOOD −0.3 V to +22 V SW −1 V to +22 V BST VSW + 6 V FB, SS, COMP, SYNC, RT −0.3 V to +6 V VREG −0.3 V to +12 V PGND to GND −0.3 V to +0.3 V Operating Junction Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a 4-layer, JEDEC standard circuit board for surface- mount packages. Table 3. Thermal Resistance Package Type θJA Unit 24-Lead LFCSP_WQ 42.6 °C/W ESD CAUTION |
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