FDC6304P datasheet(2/4 Pages) FAIRCHILD

No. de pieza	FDC6304P

Descripción Electrónicos	Digital FET, Dual P-Channel

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Fabricante Electrónico	FAIRCHILD [Fairchild Semiconductor]

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Electrical Characteristics (T

A = 25

O

C unless otherwise noted )

Symbol

Parameter

Conditions

Min

Typ

Max

Units

OFF CHARACTERISTICS

BV

DSS

Drain-Source Breakdown Voltage

V

GS = 0 V, ID = -250 µA

-25

V

∆BV

DSS/∆TJ

Breakdown Voltage Temp. Coefficient

I

D = -250 µA, Referenced to 25

o C

-22

mV /

o C

I

DSS

Zero Gate Voltage Drain Current

V

DS = -20 V, VGS = 0 V

-1

µA

T

J = 55°C

-10

µA

I

GSS

Gate - Body Leakage Current

V

GS = -8 V, VDS= 0 V

-100

nA

ON CHARACTERISTICS (Note 2)

∆V

GS(th)/∆TJ

Gate Threshold Voltage Temp. Coefficient

I

D = -250 µA, Referenced to 25

o C

2.1

mV /

o C

V

GS(th)

Gate Threshold Voltage

V

DS = VGS, ID = -250 µA

-0.65

-0.86

-1.5

V

R

DS(ON)

Static Drain-Source On-Resistance

V

GS = -2.7 V, ID = -0.25 A

1.22

1.5

Ω

V

GS = -4.5 V, ID = -0.5 A

0.87

1.1

T

J =125°C

1.21

2

I

D(ON)

On-State Drain Current

V

GS = -2.7 V, VDS = -5 V

-0.5

A

V

GS = -4.5 V, VDS = -5 V

-1

g

FS

Forward Transconductance

V

DS = -5 V, ID= -0.5 A

0.8

S

DYNAMIC CHARACTERISTICS

C

iss

Input Capacitance

V

DS = -10 V, VGS = 0 V,

f = 1.0 MHz

62

pF

C

oss

Output Capacitance

35

pF

C

rss

Reverse Transfer Capacitance

9.5

pF

SWITCHING CHARACTERISTICS (Note 2)

t

D(on)

Turn - On Delay Time

V

DD = -6 V, ID = -0.5 A,

V

GS = -4.5 V, RGEN = 50 Ω

7

20

ns

t

r

Turn - On Rise Time

8

20

ns

t

D(off)

Turn - Off Delay Time

55

110

ns

t

f

Turn - Off Fall Time

35

70

ns

Q

g

Total Gate Charge

V

DS = -5 V, ID = - 0.25 A,

V

GS = -4.5 V

1.1

1.5

nC

Q

gs

Gate-Source Charge

0.32

nC

Q

gd

Gate-Drain Charge

0.28

nC

DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS

I

S

Maximum Continuous Drain-Source Diode Forward Current

-0.5

A

V

SD

Drain-Source Diode Forward Voltage

V

GS = 0 V, IS = -0.5 A

(Note 2)

-0.88

-1.2

V

Notes:

1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by

design while RθCA is determined by the user's board design.

2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.

FDC6304P Rev.D

b. 180

OC/W on a 0.005 in2 of pad

of 2oz copper.

a. 140

OC/W on a 0.125 in2 pad of

2oz copper.

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