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UC2907DWTR Datasheet(PDF) 8 Page - Texas Instruments

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No. de pieza UC2907DWTR
Descripción Electrónicos  LOAD SHARE CONTROLLER
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI1 - Texas Instruments

UC2907DWTR Datasheet(HTML) 8 Page - Texas Instruments

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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
UC1907J
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
UC1907J883B
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
UC1907L
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
UC1907L883B
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
UC2907DW
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC2907DWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC2907DWTR
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC2907DWTRG4
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC2907J
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
UC2907N
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC2907NG4
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3907DW
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3907DWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3907DWTR
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3907DWTRG4
ACTIVE
SOIC
DW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UC3907J
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
UC3907N
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UC3907NG4
ACTIVE
PDIP
N
16
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
Addendum-Page 1


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