FDG6308P Rev B (W)

Typical Characteristics

0

1

2

3

4

5

0

0.3

0.6

0.9

1.2

1.5

1.8

2.1

I

V

-15V

-10V

0

40

80

120

160

200

0

4

8

12

16

20

f = 1MHz

Figure 7. Gate Charge Characteristics.

Figure 8. Capacitance Characteristics.

0.01

0.1

1

10

0.1

1

10

100

DC

1s

100ms

10ms

1ms

100

µs

SINGLE PULSE

0

6

12

18

24

30

0.0001

0.001

0.01

0.1

1

10

100

SINGLE PULSE TIME (SEC)

SINGLE PULSE

Figure 9. Maximum Safe Operating Area.

Figure 10. Single Pulse Maximum

Power Dissipation.

0.001

0.01

0.1

1

0.0001

0.001

0.01

0.1

1

10

100

P(pk)

SINGLE PULSE

0.01

0.02

0.05

0.1

0.2

D = 0.5

Figure 11. Transient Thermal Response Curve.

Thermal characterization performed using the conditions described in Note 1.

Transient thermal response will change depending on the circuit board design.