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LM385MX-1.2 Datasheet(PDF) 1 Page - Texas Instruments |
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LM385MX-1.2 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 23 page LM185-1.2-N, LM285-1.2-N, LM385-1.2-N www.ti.com SNVS742E – JANUARY 2000 – REVISED APRIL 2013 LM185-1.2-N/LM285-1.2-N/LM385-1.2-N Micropower Voltage Reference Diode Check for Samples: LM185-1.2-N, LM285-1.2-N, LM385-1.2-N Careful design of the LM185-1.2-N has made the 1 FEATURES device exceptionally tolerant of capacitive loading, 2 • ±1% and 2% Initial Tolerance making it easy to use in almost any reference • Operating Current of 10 μA to 20mA application. The wide dynamic operating range allows its use with widely varying supplies with excellent • 1 Ω Dynamic Impedance regulation. • Low Temperature Coefficient The extremely low power drain of the LM185-1.2-N • Low Voltage Reference—1.235V makes it useful for micropower circuitry. This voltage • 2.5V Device and Adjustable Device Also reference can be used to make portable meters, Available regulators or general purpose analog circuitry with • LM185-2.5 Series and LM185 Series, battery life approaching shelf life. respectively Further, the wide operating current allows it to replace older references with a tighter tolerance part. DESCRIPTION The LM185-1.2-N is rated for operation over a −55°C The LM185-1.2-N/LM285-1.2-N/LM385-1.2-N are to 125°C temperature range while the LM285-1.2-N is micropower 2-terminal band-gap voltage regulator rated −40°C to 85°C and the LM385-1.2-N 0°C to diodes. Operating over a 10 μA to 20mA current 70°C. The LM185-1.2-N/LM285-1.2-N are available in range, they feature exceptionally low dynamic a hermetic TO package and the LM285-1.2-N/LM385- impedance and good temperature stability. On-chip 1.2-N are also available in a low-cost TO-92 molded trimming is used to provide tight voltage tolerance. package, as well as SOIC and SOT-23. Since the LM185-1.2-N band-gap reference uses only transistors and resistors, low noise and good long term stability result. CONNECTION DIAGRAM Figure 1. T0-92 Package (LP) (Bottom View) Figure 3. SOIC Package * Pin 3 is attached to the Die Attach Pad (DAP) and should be connected to Pin 2 or left floating. Figure 2. SOT-23 Figure 4. TO Package (NDV) (Bottom View) 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Copyright © 2000–2013, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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