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LM3940ISX-3.3 Datasheet(PDF) 8 Page - Texas Instruments |
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LM3940ISX-3.3 Datasheet(HTML) 8 Page - Texas Instruments |
8 / 18 page LM3940 SNVS114E – MAY 1999 – REVISED MARCH 2013 www.ti.com Figure 21. θ(JA) vs. Copper (1 ounce) Area for the DDPAK/TO-263 Package As shown in Figure 21, increasing the copper area beyond 1 square inch produces very little improvement. It should also be observed that the minimum value of θ(JA) for the DDPAK/TO-263 package mounted to a PCB is 32°C/W. As a design aid, Figure 22 shows the maximum allowable power dissipation compared to ambient temperature for the DDPAK/TO-263 device (assuming θ(JA) is 35°C/W and the maximum junction temperature is 125°C). Figure 22. Maximum Power Dissipation vs. TAMB for the DDPAK/TO-263 Package Figure 23 and Figure 24 show the information for the SOT-223 package. Figure 24 assumes a θ(JA) of 74°C/W for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of 125°C. Figure 23. θ(JA) vs. Copper (2 ounce) Area for the SOT-223 Package 8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM3940 |
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