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TPS40054PWP Datasheet(PDF) 2 Page - Texas Instruments |
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TPS40054PWP Datasheet(HTML) 2 Page - Texas Instruments |
2 / 35 page TPS40054 TPS40055 TPS40057 SLUS593H – DECEMBER 2003 – REVISED JULY 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION TA PACKAGE APPLICATION OUTPUT SUPPLY MINIMUM QUANTITY DEVICE NUMBER Tube 90 TPS40054PWP Source Tape and Reel 2000 TPS40054PWPR Tube 90 TPS40055PWP Plastic HTSSOP –40°C to 85°C Source/Sink (PWP) Tape and Reel 2000 TPS40055PWPR Tube 90 TPS40057PWP Source/Sink with prebias Tape and Reel 2000 TPS40057PWPR DEVICE RATINGS ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted (1) TPS40054 TPS40055 UNIT TPS40057 VFB, SS/SD, SYNC –0.3 to 6 VIN, SW –0.3 to 45 VIN Input voltage range SW, transient < 50 ns –2.5 SW, transient < 50 ns, VVIN < 14 V –5.0 KFF, with IIN(max) = – 5 mA –0.3 to 11 COMP, RT, SS/SD –0.3 to 6 Output voltage VO range KFF 5 mA IO Output current RT 200 µA TJ Maximum junction temperature (2) 150 TJ Operating junction temperature range –40 to 125 °C Tstg Storage temperature –55 to 150 (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Device may shut down at junction temperatures below 150°C RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT VIN Input voltage 8 40 V TA Operating free-air temperature –40 85 °C THERMAL INFORMATION THERMAL METRIC(1) PWP (20 PINS) UNITS θJA Junction-to-ambient thermal resistance 38.3 θJCtop Junction-to-case (top) thermal resistance 28.0 θJB Junction-to-board thermal resistance 9.0 °C/W ψJT Junction-to-top characterization parameter 0.4 ψJB Junction-to-board characterization parameter 8.9 θJCbot Junction-to-case (bottom) thermal resistance 2.9 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2003–2012, Texas Instruments Incorporated Product Folder Link(s): TPS40054 TPS40055 TPS40057 |
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