PACKAGE OPTION ADDENDUM

www.ti.com

24-Jan-2013

Addendum-Page 2

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

Op Temp (°C)

Top-Side Markings

(4)

Samples

TPS3305-33DG4

ACTIVE

SOIC

D

8

75

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

30533

TPS3305-33DGN

ACTIVE

MSOP-

PowerPAD

DGN

8

80

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

AAO

TPS3305-33DGNG4

ACTIVE

MSOP-

PowerPAD

DGN

8

80

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

AAO

TPS3305-33DGNR

ACTIVE

MSOP-

PowerPAD

DGN

8

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

AAO

TPS3305-33DGNRG4

ACTIVE

MSOP-

PowerPAD

DGN

8

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

AAO

TPS3305-33DR

ACTIVE

SOIC

D

8

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

30533

TPS3305-33DRG4

ACTIVE

SOIC

D

8

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

-40 to 85

30533

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and