TPS51363

www.ti.com

SLUSBB5A – FEBRUARY 2013 – REVISED JUNE 2013

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THERMAL INFORMATION

TPS51363

UNITS

QFN (RVE)

(28 PINS)

Junction-to-ambient thermal resistance

40.2

Junction-to-case (top) thermal resistance

22.8

Junction-to-board thermal resistance

20.1

°C/W

Junction-to-top characterization parameter

1.6

Junction-to-board characterization parameter

19.4

Junction-to-case (bottom) thermal resistance

2.2

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIN

3

22

Supply voltage range

V5

4.6

5.5

BST

–0.1

33.5

SW

–3

27

EN, TRIP, NU, MODE

–0.1

5.5

Input voltage range

V

SLEW, VSNS, REFIN, REFIN2

–0.1

3.5

GSNS

–0.1

0.3

PGND

–0.1

0.1

PGOOD

–0.1

5.5

Output voltage range

VREF, SLEW

–0.1

3.5

–10

85

°C

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