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SI3455DV Datasheet(PDF) 2 Page - Fairchild Semiconductor

No. de pieza SI3455DV
Descripción Electrónicos  Single P-Channel Logic Level PowerTrench MOSFET
Download  5 Pages
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Fabricante Electrónico  FAIRCHILD [Fairchild Semiconductor]
Página de inicio  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

SI3455DV Datasheet(HTML) 2 Page - Fairchild Semiconductor

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Si3455DV Rev A1 (W)
Electrical Characteristics
T
A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ Max Units
Off Characteristics
BVDSS
Drain–Source Breakdown Voltage
VGS = 0 V, ID = –250 µA
–30
V
∆BVDSS
∆TJ
Breakdown Voltage Temperature
Coefficient
ID = –250 µA,Referenced to 25°C
–22
mV/
°C
IDSS
Zero Gate Voltage Drain Current
VDS = –24 V,
VGS = 0 V
–1
µA
IGSSF
Gate–Body Leakage, Forward
VGS = 20 V,
VDS = 0 V
100
nA
IGSSR
Gate–Body Leakage, Reverse
VGS = –20 V
VDS = 0 V
–100
nA
On Characteristics
(Note 2)
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = –250 µA
–1
–1.9
–3
V
∆VGS(th)
∆TJ
Gate Threshold Voltage
Temperature Coefficient
ID = –250 µA,Referenced to 25°C
4
mV/
°C
RDS(on)
Static Drain–Source
On–Resistance
VGS = –10 V,
ID = –3.6 A
VGS = –4.5 V,
ID = –2.7 A
VGS = –10 V, ID = –3.6ATJ=125°
63
100
90
75
125
113
m
ID(on)
On–State Drain Current
VGS = –4.5 V,
VDS = –5 V
–5
A
gFS
Forward Transconductance
VDS = –5 V,
ID = –3.6 A
6
S
Dynamic Characteristics
Ciss
Input Capacitance
298
pF
Coss
Output Capacitance
83
pF
Crss
Reverse Transfer Capacitance
VDS = –15 V,
V GS = 0 V,
f = 1.0 MHz
39
pF
Switching Characteristics (Note 2)
td(on)
Turn–On Delay Time
6
12
ns
tr
Turn–On Rise Time
13
23
ns
td(off)
Turn–Off Delay Time
11
20
ns
tf
Turn–Off Fall Time
VDD = –15 V,
ID = –1 A,
VGS = –10 V,
RGEN = 6 Ω
6
12
ns
Qg
Total Gate Charge
3.6
5
nC
Qgs
Gate–Source Charge
1
nC
Qgd
Gate–Drain Charge
VDS = –15 V,
ID = –3.6 A,
VGS = –.5 V
1.2
nC
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
–1.3
A
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V,
IS = –1.3 A (Note 2)
–0.8
–1.2
V
Notes:
1. R
θJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R
θJC is guaranteed by design while RθCA is determined by the user's board design.
a)
78°C/W when
mounted on a 1in
2 pad
of 2 oz copper
b)
156°C/W when mounted
on a minimum pad of 2 oz
copper
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300
µs, Duty Cycle < 2.0%


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