MC07XSF517EK datasheet(11/72 Pages) FREESCALE

No. de pieza	MC07XSF517EK

Descripción Electrónicos	Triple 7.0 mOhm and Dual 17 mOhm High Side Switch

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Fabricante Electrónico	FREESCALE [Freescale Semiconductor, Inc]

Página de inicio	http://www.freescale.com

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Analog Integrated Circuit Device Data



Freescale Semiconductor

11

MC07XSF517

4.3

Thermal Characteristics

4.4

Operating Conditions

This section describes the operating conditions of the device. Conditions apply to all the following data, unless otherwise noted.

Table 4. Thermal Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent

damage to the device.

Symbol

Description (Rating)

Min.

Max.

Unit

Notes

THERMAL RATINGS

TA

TJ

Operating Temperature

• Ambient

• Junction

-40

+125

+150

°C

(7)

TSTG

Storage Temperature

-55

+ 150

°C

TPPRT

Peak Package Reflow Temperature During Reflow

–

260

°C

(8) (9)

THERMAL RESISTANCE AND PACKAGE DISSIPATION RATINGS

RJB

Junction-to-Board (1]Soldered to Board)

–

2.5

°/W

(10)

RJA

Junction-to-Ambient, Natural Convection, Four-Layer Board (2s2p)

–

17.4

°/W

(11) (12)

RJC

Junction-to-Case (Case top surface)

–

10.6

°/W

(13)

Notes

7.

To achieve high reliability over 10 years of continuous operation, the device's continuous operating junction temperature should not

exceed 125

C.

8.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

9.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

10.

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top

surface of the board near the package.

11.

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature,

ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

12.

Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.

13.

Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).

Table 5. Operating Conditions

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent

damage to the device.

Symbol

Ratings

Min

Max

Unit

Notes

VPWR

Functional operating supply voltage - Device is fully

functional. All features are operating.

7.0

18

V

Overvoltage range

• Jump Start

• Load dump

–

28

40

V

Reverse Supply

-16

–

V

VCC

Functional operating supply voltage - Device is fully

functional. All features are operating.

4.5

5.5

V

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MC07XSF517EK Datasheet(PDF) 11 Page - Freescale Semiconductor, Inc

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