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TMP300BIDBVR Datasheet(PDF) 2 Page - Texas Instruments |
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TMP300BIDBVR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 18 page TMP300 SBOS335C – JUNE 2005 – REVISED JANUARY 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING SC70-6 DCK BPN TMP300 SOT23-6 DBV T300 SC70-6 DCK QWL TMP300B SOT23-6 DBV DUDC (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) VALUE UNIT Supply Voltage V+ +18 V Signal Input Terminals, Voltage(2) –0.5 to (V+) + 0.5 V Signal Input Terminals, Current(2) ±10 mA Output Short-Circuit(3) ISC Continuous Open-Drain Output (V+) + 0.5 V Operating Temperature TA –40 to +150 °C Storage Temperature TA –55 to +150 °C Junction Temperature TJ +150 °C Human Body Model (HBM) 4000 V ESD Rating Charged Device Model (CDM) 1000 V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less. (3) Short-circuit to ground. 2 Submit Documentation Feedback Copyright © 2005–2011, Texas Instruments Incorporated Product Folder Link(s): TMP300 |
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