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BUF602ID Datasheet(PDF) 2 Page - Texas Instruments

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No. de pieza BUF602ID
Descripción Electrónicos  High-Speed, Closed-Loop Buffer
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Fabricante Electrónico  TI [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI - Texas Instruments

BUF602ID Datasheet(HTML) 2 Page - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS
(1)
Top View
1
2
3
5
4
Out
−V
CC
V
REF
+V
CC
In
AWO
Pin Orientation/Package Marking
SOT23−5
x1
x1
200
50k
50k
1
2
3
4
8
7
6
5
+V
CC
NC
NC
In
Out
NC
V
REF
−V
CC
SO−8
NC = No Connection
x1
x1
200
50k
50k
BUF602
SBOS339B – OCTOBER 2005 – REVISED MAY 2008 ...................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
SPECIFIED
PACKAGE
TEMPERATURE
PACKAGE
ORDERING
TRANSPORT MEDIA,
PRODUCT
PACKAGE
DESIGNATOR
RANGE
MARKING
NUMBER
QUANTITY
BUF602ID
Rails, 75
BUF602
SO-8
D
–45
°C to +85°C
BUF602
BUF602IDR
Tape and Reel, 2500
BUF602IDBVT
Tape and Reel, 250
BUF602
SOT23-5
DBV
–45
°C to +85°C
AWO
BUF602IDBVR
Tape and Reel, 3000
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document or see the TI
web site at www.ti.com.
Power Supply
±6.5VDC
Internal Power Dissipation
See Thermal Information
Input Common-Mode Voltage Range
±VS
Storage Temperature Range: D, DBV
–65
°C to +125°C
Lead Temperature (soldering, 10s)
+300
°C
Junction Temperature (TJ)
+150
°C
ESD Rating:
Human Body Model (HBM)
2000V
Charge Device Model (CDM)
1000V
Machine Model (MM)
200V
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
2
Submit Documentation Feedback
Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): BUF602


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