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DAC7621 Datasheet(PDF) 3 Page - Burr-Brown (TI) |
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DAC7621 Datasheet(HTML) 3 Page - Burr-Brown (TI) |
3 / 11 page ® 3 DAC7621 PIN CONFIGURATION Top View SSOP VDD to GND .......................................................................... –0.3V to 6V Digital Inputs to GND .............................................. –0.3V to VDD + 0.3V VOUT to GND ........................................................... –0.3V to VDD + 0.3V Power Dissipation ........................................................................ 325mW Thermal Resistance, θ JA ........................................................... 150°C/W Maximum Junction Temperature .................................................. +150 °C Operating Temperature Range ...................................... –40 °C to +85°C Storage Temperature Range ....................................... –65 °C to +150°C Lead Temperature (soldering, 10s) .............................................. +300 °C NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. ABSOLUTE MAXIMUM RATINGS(1) PIN DESCRIPTIONS PIN LABEL DESCRIPTION 1 CLR Reset. Resets the DAC register to zero. Active LOW. Asynchronous input. 2VDD Postive Power Supply 3VOUT DAC Output Voltage 4 AGND Analog Ground 5 DGND Digital Ground 6 DB11 Data Bit 11, MSB 7 DB10 Data Bit 10 8 DB9 Data Bit 9 9 DB8 Data Bit 8 10 DB7 Data Bit 7 11 DB6 Data Bit 6 12 DB5 Data Bit 5 13 DB4 Data Bit 4 14 DB3 Data Bit 3 15 DB2 Data Bit 2 16 DB1 Data Bit 1 17 DB0 Data Bit 0, LSB 18 R/W Read and Write Control 19 CS Chip Select. Active LOW. 20 LOADDAC Loads the internal DAC register. The DAC register is a transparent latch and is transparent when LOADDAC is LOW (regardless of the state of CS or CLK). ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degrada- tion to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION MINIMUM RELATIVE DIFFERENTIAL SPECIFICATION PACKAGE ACCURACY NONLINEARITY TEMPERATURE DRAWING ORDERING TRANSPORT PRODUCT (LSB) (LSB) RANGE PACKAGE NUMBER(1) NUMBER(2) MEDIA DAC7621E ±2 ±1 –40 °C to +85°C 20-Lead SSOP 334 DAC7621E Rails "" " " "" DAC7621E/1K Tape and Reel DAC7621EB ±1 ±1 –40 °C to +85°C 20-Lead SSOP 334 DAC7621EB Rails "" " " "" DAC7621EB/1K Tape and Reel NOTES: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. (2) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /1K indicates 1000 devices per reel). Ordering 1000 pieces of “DAC7621E/1K” will get a single 1000-piece Tape and Reel. For detailed Tape and Reel mechanical information, refer to Appendix B of Burr-Brown IC Data Book. 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 CLR V DD V OUT AGND DGND DB11 (MSB) DB10 DB9 DB8 DB7 LOADDAC CS R/W DB0 (LSB) DB1 DB2 DB3 DB4 DB5 DB6 DAC7621E |
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Descripción similar - DAC7621 |
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