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AD5684 Datasheet(PDF) 7 Page - Analog Devices

No. de pieza AD5684
Descripción Electrónicos  Quad, 16-/12-Bit nanoDAC with I2C Interface
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Fabricante Electrónico  AD [Analog Devices]
Página de inicio  http://www.analog.com
Logo AD - Analog Devices

AD5684 Datasheet(HTML) 7 Page - Analog Devices

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Data Sheet
AD5696/AD5694
Rev. A | Page 7 of 24
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 5.
Parameter
Rating
VDD to GND
−0.3 V to +7 V
VLOGIC to GND
−0.3 V to +7 V
VOUT to GND
−0.3 V to VDD + 0.3 V
VREF to GND
−0.3 V to VDD + 0.3 V
Digital Input Voltage to GND1
−0.3 V to VLOGIC + 0.3 V
SDA and SCL to GND
−0.3 V to +7 V
Operating Temperature Range
−40°C to +105°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature
125°C
Reflow Soldering Peak Temperature,
Pb Free (J-STD-020)
260°C
ESD
Human Body Model (HBM)
3.5 kV
Field-Induced Charged Device
Model (FICDM)
1.5 kV
1
Excluding SDA and SCL.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. This
value was measured using a JEDEC standard 4-layer board with
zero airflow. For the LFCSP package, the exposed pad must be
tied to GND.
Table 6. Thermal Resistance
Package Type
θJA
Unit
16-Lead LFCSP
70
°C/W
16-Lead TSSOP
112.6
°C/W
ESD CAUTION


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