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BD3571YFP-ME2 Datasheet(PDF) 9 Page - Rohm |
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BD3571YFP-ME2 Datasheet(HTML) 9 Page - Rohm |
9 / 20 page Datasheet Datasheet 9/17 TSZ02201-0T2T0AN00160-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 19.Sep.2013 Rev.002 www.rohm.com TSZ22111 • 15 • 001 BD357xYFP-M BD357xYHFP-M Series Power Dissipation Refer to the heat mitigation characteristics illustrated in Figure 20, 21 and 22 when using the IC in an environment where Ta ≥ 25 °C. The characteristics of the IC are greatly influenced by the operating temperature. If the temperature is in excess of the maximum junction temperature Tjmax, the elements of the IC may be deteriorated or be damaged. It is necessary to give sufficient consideration to the heat of the IC in view of two points, i.e., the protection of the IC from instantaneous damage and the maintenance of the reliability of the IC in long-time operation. In order to protect the IC from thermal destruction, it is necessary to operate the IC in temperatures not exceeding the maximum junction temperature Tjmax. Figure 20 illustrates the power dissipation/heat mitigation characteristics for the TO252-3 package. Operate the IC within the power dissipation (Pd) capabilities. The following method is used to calculate the power consumption PC (W). Where: VCC is the input voltage. VO is the output voltage. IO is the load current. ICC is the total supply current. Pd is the power dissipation. The load current IO is obtained to operate the IC within its power dissipation capacity. (For more information about ICC, see Figure 15.) The maximum load current Iomax for the applied voltage VCC can be calculated during the thermal design process. 0 0.4 1.2 W 0 0.8 1.2 1.6 2.0 25 50 75 100 125 150 IC mounted on a ROHM standard board Substrate size: 70 mm x 70 mm x 1.6 mm θja = 104.2 (°C / W) Ambient Temperature: Ta [°C] TO252-3 Figure 20 0 0.4 1.3W 0 0.8 1.2 1.6 2.0 25 50 75 100 125 150 Ambient Temperature: Ta [°C] IC mounted on a ROHM standard board Substrate size: 70 mm x 70 mm x 1.6 mm θja = 96.2 (°C / W) TO252-5 Figure 21 0 0.4 1.6 W 0 0.8 1.2 1.6 2.0 25 50 75 100 125 150 IC mounted on a ROHM standard board Substrate size: 70 mm x 70 mm x 1.6 mm θja = 78.1 (°C / W) Ambient Temperature: Ta [°C] HRP5 Figure 22 |
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