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SD3110-151-R Datasheet(PDF) 1 Page - Cooper Bussmann, Inc. |
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SD3110-151-R Datasheet(HTML) 1 Page - Cooper Bussmann, Inc. |
1 / 3 page Description • 125°C maximum total temperature operation • 3.1mm x 3.1mm x 1.0mm shielded drum core • Ferrite core material • Inductance range from 0.5uH to 220uH • Current range from 2.27 Amps to 0.106 Amps • Frequency range up to 1MHz Applications • Cellular phones, Digital cameras, CD players, PDA’s • Small LCD displays • LED driver and LED flash circuits • Hard disk drives • Backlighting • EL panel Environmental Data • Storage temperature range: -40°C to +125°C • Operating temperature range: -40°C to +125°C (range is application specific) • Solder reflow temperature: +260°C max. for 10 seconds maximum Packaging • Supplied in tape and reel packaging, 4100 per reel SD3110 Series Low Profile Power Inductors Part Number Rated OCL (1) Part Irms (2) Isat (3) DCR ( Ω) K-factor Inductance (µH) Marking Amperes Amperes typ. @ (4) (µH) Designator 20°C SD3110-R50-R 0.50 0.44+/-30% A 1.54 2.27 0.0420 216 SD3110-R82-R 0.82 0.82+/-30% B 1.30 1.67 0.0589 191 SD3110-1R0-R 1.0 1.05+/-30% C 1.21 1.47 0.0683 169 SD3110-1R5-R 1.5 1.60+/-30% D 0.99 1.19 0.103 137 SD3110-2R2-R 2.2 2.27+/-30% E 0.82 1.00 0.149 115 SD3110-3R3-R 3.3 3.48+/-30% F 0.72 0.81 0.195 93 SD3110-4R7-R 4.7 4.96+/-30% G 0.59 0.68 0.285 78 SD3110-6R8-R 6.8 6.70+/-30% H 0.54 0.58 0.346 67 SD3110-8R2-R 8.2 8.01+/-30% I 0.48 0.53 0.432 61 SD3110-100-R 10.0 10.18+/-30% J 0.44 0.47 0.505 54 SD3110-150-R 15.0 15.32+/-20% K 0.36 0.38 0.764 44 SD3110-220-R 22.0 21.49+/-20% L 0.30 0.32 1.13 37 SD3110-330-R 33.0 32.72+/-20% M 0.26 0.26 1.50 30 SD3110-470-R 47.0 46.29+/-20% N 0.22 0.22 2.06 25 SD3110-680-R 68.0 68.04+/-20% O 0.179 0.182 3.13 21 SD3110-820-R 82.0 82.65+/-20% P 0.167 0.166 3.57 19 SD3110-101-R 100 101+/-20% Q 0.146 0.150 4.72 17 SD3110-151-R 150 149+/-20% R 0.127 0.123 6.16 14 SD3110-221-R 220 219+/-20% S 0.106 0.120 9.46 12 (1) Open Circuit Inductance Test Parameters: 100kHz, 0.1V, 0.0Adc. (2) Irms: DC current for an approximate DT of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. (3) Isat Amperes peak for approximately 30% rolloff (@20°C) (4) K-factor: Used to determine B p-p for core loss (see graph). B p-p = K*L* ∆I, B p-p(mT), K: (K factor from table), L: (Inductance in uH), ∆I (Peak to peak ripple current in Amps). RoHS 2002/95/EC |
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