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CS3717A Datasheet(PDF) 7 Page - Cherry Semiconductor Corporation |
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CS3717A Datasheet(HTML) 7 Page - Cherry Semiconductor Corporation |
7 / 8 page 7 Application Circuit - Two Phase Bipolar Stepper Motor Driver 1 W VS 1k W RC CC 0.1 mF CS-3717A C2 C1 100 mF 820pF 1k W RC 1 W RSense CC 820pF CT 820pF CT 820pF Comp In Gnd IN0 56k W RT 56k W RT CS3717A IMA IMB MBA MAA STEPPER MOTOR VSS 0.1 mF C3 FROM m PROCESSOR Gnd Sense Out B OutA V DD A V DD B V CC VREF IN1 DIRECTION Pulse VCC VREF Sense Gnd Pulse DIRECTION IN0 IN1 VDD A OUTA OUTB VDD B Gnd RSense CS3717A COMP IN The RQJA of the CS3717A can be reduced by soldering the Gnd pins to a suitable copper area of the printed circuit board or to an external heatsink. The diagram of fig. 2 shows the maximum dissipated power Ptot and the RQJA as a function of the side Òl Ó of two equal square copper areas having a thickness of 35µ (see fig. 1). In addition, it is possible to use an external heatsink (see fig. 3). During soldering the pins temperature must not exceed 260ûC and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. Mounting Instructions Figure 2 - Max. Power Dissipation And Junction To Ambient Thermal Resistance vs. Size ÒlÓ for 16 lead fused package. 1 2 3 4 Ptot (W) 10 20 30 40 I(mm) 0 0 20 40 60 80 (ûC/W) 0 ÒlÓ Ptot (Tamb = 70ûC) Rq JA Rq JA l l COPPER AREA 35 m THICKNESS P.C. BOARD Figure 1 - Example of P.C. Board Copper Area Which is Used as Heatsink with 16 lead fused package. 170mm 38.0mm 11.9mm 0 -50 1 2 3 4 5 Ptot (W) 0 50 100 Tamb (C) FREE AIR HEA T - SINK WITH R th = 25ûC/W Figure 3 - External Heatsink Mounting Example (Rth = 30ûC/W) for 16 lead batwing package. Figure 4 - Maximum Allowable Power Dissipation vs. Ambient Temperature for 16 lead batwing package. |
Número de pieza similar - CS3717A |
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Descripción similar - CS3717A |
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