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SI7005-B-GM Datasheet(PDF) 9 Page - Silicon Laboratories |
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SI7005-B-GM Datasheet(HTML) 9 Page - Silicon Laboratories |
9 / 41 page Si7005 Rev. 1.2 9 Table 6. Thermal Characteristics Parameter Symbol Test Condition QFN-24 Unit Junction-to-Air Thermal Resistance JA JEDEC 4-layer board 55 °C/W Junction-to-Air Thermal Resistance JA 2-layer evaluation PCB with minimal thermal pad 110 °C/W Table 7. Absolute Maximum Ratings1,2 Parameter Symbol Test Condition Min Typ Max Unit Ambient Temperature under Bias –55 — 125 °C Storage Temperature –65 — 150 °C Voltage on SDA or SCL pin with respect to GND –0.3 — 3.9 V Voltage on CS pin with respect to GND –0.3 — VDD + 0.3 V Voltage on VDD with respect to GND –0.3 — 4.2 V ESD Tolerance HBM — — 3 kV CDM — — 750 V MM — — 300 V Notes: 1. Absolute maximum ratings are stress ratings only; operation at or beyond these conditions is not implied and may shorten the life of the device or alter its performance. 2. For best accuracy, after removal from the sealed shipping bags, the Si7005 should be stored in climate controlled conditions (10 to 35 °C, 20 to 60 %RH). Exposure to high temperature and/or high humidity environments can cause a small upwards shift in RH readings. |
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