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TPS3307Y Chip Information

56

48

TPS3307Y

(1)

(2)

(3)

(5)

(6)

CHIP THICKNESS: 10 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS

(4)

(7)

(8)

TPS3307-18, TPS3307-25, TPS3307-33

SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006

These chips, when properly assembled, display characteristics similar to those of the TPS3307. Thermal

compression or ultrasonic bonding may take place on the doped aluminium bonding pads. The chips may be

mounted with conductive epoxy or a gold-silicon preform.

Table 2. Terminal Functions

TERMINAL

I/O

DESCRIPTION

NAME

NO.

GND

4

Ground

MR

7

I

Manual reset

RESET

5

O

Active-low reset output

RESET

6

O

Active-high reset output

SENSE1

1

I

Sense voltage input 1

SENSE2

2

I

Sense voltage input 2

SENSE3

3

I

Sense voltage input 3

8

Supply voltage

4

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