CDCM6208 datasheet(2/89 Pages) TI1

No. de pieza	CDCM6208

Descripción Electrónicos	2:8 Clock Generator, Jitter Cleaner With Fractional Dividers

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Fabricante Electrónico	TI1 [Texas Instruments]

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CDCM6208

SCAS931F – MAY 2012 – REVISED APRIL 2014

www.ti.com

Table of Contents

Characteristics ......................................................... 15

1

Features .................................................................. 1

7.20

Device Individual Block Current Consumption...... 16

2

Applications ........................................................... 1

7.21

Worst Case Current Consumption ........................ 17

3

Description ............................................................. 1

7.22

Timing Requirements, I2C Timing ......................... 17

4

Simplified Schematics........................................... 1

7.23

Typical Characteristics .......................................... 19

5

Revision History..................................................... 2

8

Parameter Measurement Information ................ 21

6

Pin Configuration and Functions ......................... 4

9

Detailed Description ............................................ 26

7

Specifications......................................................... 6

9.1

Overview ................................................................. 26

7.1

Absolute Maximum Ratings ...................................... 6

9.2

Functional Block Diagram ....................................... 26

7.2

Handling Ratings....................................................... 6

9.3

Feature Description................................................. 26

7.3

Recommended Operating Conditions ....................... 7

9.4

Device Functional Modes........................................ 35

7.4

Thermal Information, Airflow = 0 LFM....................... 7

9.5

Programming........................................................... 48

7.5

Thermal Information, Airflow = 150 LFM................... 8

9.6

Register Maps ......................................................... 49

7.6

Thermal Information, Airflow = 250 LFM................... 8

10

Application and Implementation........................ 61

7.7

Thermal Information, Airflow = 500 LFM................... 8

10.1

Application Information.......................................... 61

7.8

Single Ended Input Characteristics (SI_MODE[1:0],

10.2

Typical Applications .............................................. 61

SDI/SDA/PIN1, SCL/PIN4, SDO/ADD0/PIN2,

SCS/ADD1/PIN3, STATUS1/PIN0, RESETN/PWR,

11

Power Supply Recommendations ..................... 70

PDN, SYNCN, REF_SEL).......................................... 9

11.1

Power Rail Sequencing, Power Supply Ramp Rate,

7.9

Single Ended Input Characteristics (PRI_REF,

and Mixing Supply Domains .................................... 70

SEC_REF) ................................................................. 9

11.2

Device Power up Timing ....................................... 71

7.10

Differential Input Characteristics (PRI_REF,

11.3

Power Down.......................................................... 74

SEC_REF) ............................................................... 10

11.4

Power Supply Ripple Rejection (PSRR) versus

7.11

Crystal Input Characteristics (SEC_REF) ............ 10

Ripple Frequency ..................................................... 74

7.12

Single Ended Output Characteristics (STATUS1,

12

Layout................................................................... 75

STATUS0, SDO, SDA) ............................................ 11

12.1

Layout Guidelines ................................................. 75

7.13

PLL Characteristics .............................................. 11

12.2

Reference Schematics .......................................... 77

7.14

LVCMOS Output Characteristics ......................... 12

13

Device and Documentation Support ................. 81

7.15

LVPECL (High-Swing CML) Output

13.1

Trademarks ........................................................... 81

Characteristics ......................................................... 13

13.2

Electrostatic Discharge Caution ............................ 81

7.16

CML Output Characteristics................................. 13

13.3

Glossary ................................................................ 81

7.17

LVDS (Low-Power CML) Output Characteristics . 14

14

Mechanical, Packaging, and Orderable

7.18

HCSL Output Characteristics............................... 14

Information ........................................................... 81

7.19

Output Skew and Sync to Output Propagation Delay

5 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision E (March 2013) to Revision F

Page

•

Changed layout of data sheet to conform to new TI standards. Added the following sections: Handling Ratings,

Thermal Information, Typical Characteristics, Programming, Register Maps, Layout and Layout Guidelines ..................... 1

•

Changed from zero to one ................................................................................................................................................... 50

•

Added text at the end of the first paragraph in Power Down section .................................................................................. 74

•

Changed fOUT = 122.88 MHz, VDD Supply Noise = 100 mVpp............................................................................................ 74

Changes from Revision D (March 2013) to Revision E

Page

•

Changed the data sheet layout to the new TI standard ......................................................................................................... 1

•

Added the Handling Ratings table .......................................................................................................................................... 6

•

Changed Pullup and Pulldown value From: MIN = 40 To: 35 k

Ω and MAX = 60 To: 65 kΩ ................................................ 9

•

Changed the from Random Jitter, Maximum in Table 2 From: 10k - 20MHZ To: 12k - 20MHZ and From: 0.5 ps-rms

(int div) To: 0.3 ps-rms (int div) ............................................................................................................................................ 27

•

Added new Note 1 to Table 2............................................................................................................................................... 27

2

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