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LM3205 Datasheet(PDF) 3 Page - Texas Instruments |
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LM3205 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 24 page LM3205 www.ti.com SNVS388D – JULY 2005 – REVISED MAY 2009 ABSOLUTE MAXIMUM RATINGS (1) (2) VDD, PVIN to SGND −0.2V to +6.0V PGND to SGND −0.2V to +0.2V EN, FB, VCON (SGND −0.2V) to (VDD +0.2V) w/6.0V max SW (PGND −0.2V) to (PVIN +0.2V) w/6.0V max PVIN to VDD −0.2V to +0.2V Continuous Power Dissipation(3) Internally Limited Junction Temperature (TJ-MAX) +150°C Storage Temperature Range −65°C to +150°C Maximum Lead Temperature (Soldering, 10 sec) +260°C ESD Rating(4)(5) Human Body Model: 2 kV Machine Model: 200V (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. (2) All voltages are with respect to the potential at the GND pins. The LM3205 is designed for mobile phone applications where turn-on after power-up is controlled by the system controller and where requirements for a small package size overrule increased die size for internal Under Voltage Lock-Out (UVLO) circuitry. Thus, it should be kept in shutdown by holding the EN pin low until the input voltage exceeds 2.7V. (3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and disengages at TJ = 130°C (typ.). (4) The Human body model is a 100pF capacitor discharged through a 1.5k Ω resistor into each pin. (MIL-STD-883 3015.7) The machine model is a 200pF capacitor discharged directly into each pin. (5) National Semiconductor recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper ESD handling techniques can result in damage. OPERATING RATINGS (1) (2) Input Voltage Range 2.7V to 5.5V Recommended Load Current 0mA to 650mA Junction Temperature (TJ) Range −30°C to +125°C Ambient Temperature (TA) Range (3) −30°C to +85°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. (2) All voltages are with respect to the potential at the GND pins. The LM3205 is designed for mobile phone applications where turn-on after power-up is controlled by the system controller and where requirements for a small package size overrule increased die size for internal Under Voltage Lock-Out (UVLO) circuitry. Thus, it should be kept in shutdown by holding the EN pin low until the input voltage exceeds 2.7V. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). THERMAL PROPERTIES Junction-to-Ambient Thermal microSMD 100°C/W Resistance ( θJA), microSMD TLA08 Package (1) Junction-to-Ambient Thermal LLP 55°C/W Resistance ( θJA), LLP SDA10A Package (1) (1) microSMD:Junction-to-ambient thermal resistance ( θJA) is taken from thermal measurements, performed under the conditions and guidelines set forth in the JEDEC standard JESD51-7. A 4 layer, 4" x 4", 2/1/1/2 oz. Cu board as per JEDEC standards is used for the measurements. LLP: The value of ( θJA) in LLP-10 could fall in a range of 50°C/W to 150°C/W (if not wider), depending on PWB material, layout, and environmental conditions. In applications where high maximum power dissipation exits (high VIN , high IOUT ), special care must be paid to thermal dissipation areas. For more information on these topics for LLP, refer to Application Note 1187:Leadless Leadframe Package (LLP) and the Power Efficiency and Power Dissipation section of this datasheet Copyright © 2005–2009, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM3205 |
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