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LM3405A Datasheet(PDF) 3 Page - Texas Instruments |
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LM3405A Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 31 page  LM3405A www.ti.com SNVS508B – OCTOBER 2007 – REVISED OCTOBER 2008 ABSOLUTE MAXIMUM RATINGS (1) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and specifications. VALUE / UNIT VIN -0.5V to 24V SW Voltage -0.5V to 24V Boost Voltage -0.5V to 30V Boost to SW Voltage -0.5V to 6.0V FB Voltage -0.5V to 3.0V EN/DIM Voltage -0.5V to (VIN + 0.3V) Junction Temperature 150°C ESD Susceptibility (2) 2kV Storage Temperature -65°C to +150°C Soldering Information Infrared/Convection Reflow (15sec) 220°C (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings define the conditions under which the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. (2) Human body model, 1.5k Ω in series with 100pF. RECOMMENDED OPERATING CONDITIONS (1) VALUE / UNIT VIN 3V to 22V EN/DIM voltage -0.5V to (VIN + 0.3V) Boost to SW Voltage 2.5V to 5.5V Junction Temperature Range -40°C to +125°C Thermal Resistance θJA (2) SOT 118°C/W Thermal Resistance θJA (3) eMSOP8 73°C/W ILED SOT package 400mA ILED MSOP PowerPAD package 1A (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings define the conditions under which the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. (2) Thermal shutdown will occur if the junction temperature (TJ) exceeds 165°C. The maximum allowable power dissipation (PD) at any ambient temperature (TA) is PD = (TJ(MAX) – TA)/θJA . This number applies to packages soldered directly onto a 3" x 3" PC board with 2oz. copper on 4 layers in still air. For a 2 layer board using 1 oz. copper in still air, θJA = 204°C/W. (3) Thermal shutdown will occur if the junction temperature (TJ) exceeds 165°C. The maximum allowable power dissipation (PD) at any ambient temperature (TA) is PD = (TJ(MAX) – TA)/θJA . This number applies to packages soldered directly onto a 1" x 0.75" PC board with 1oz. copper on 4 layers in still air. Copyright © 2007–2008, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM3405A |
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