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74HC08D Datasheet(PDF) 8 Page - NXP Semiconductors |
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74HC08D Datasheet(HTML) 8 Page - NXP Semiconductors |
8 / 16 page 74HC_HCT08 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet Rev. 4 — 6 September 2012 8 of 16 NXP Semiconductors 74HC08; 74HCT08 Quad 2-input AND gate 12. Package outline Fig 8. Package outline SOT27-1 (DIP14) UNIT A max. 1 2 (1) (1) b1 cD (1) Z Ee MH L REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches DIMENSIONS (inch dimensions are derived from the original mm dimensions) SOT27-1 99-12-27 03-02-13 A min. A max. b max. w ME e 1 1.73 1.13 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 2.2 4.2 0.51 3.2 0.068 0.044 0.021 0.015 0.77 0.73 0.014 0.009 0.26 0.24 0.14 0.12 0.01 0.1 0.3 0.32 0.31 0.39 0.33 0.087 0.17 0.02 0.13 050G04 MO-001 SC-501-14 MH c (e ) 1 ME A L A1 w M b1 e D A2 Z 14 1 8 7 b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1 |
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