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INTERSIL |
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2 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with- out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site www.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029 Die Characteristics DIE DIMENSIONS: Size: 2390 µm x 2390µm (94 mils x 94 mils) Thickness: 525 µm ±25µm (20.6 mils ±1 mil) Bond Pad: 110 µm x 110µm (4.3 x 4.3 mils) METALLIZATION: Metal 1 Thickness: 0.7 µm ±0.1µm Metal 2 Thickness: 1.0 µm ±0.1µm SUBSTRATE POTENTIAL Unbiased Insulator PASSIVATION: Type: Phosphorous Silicon Glass (PSG) Thickness: 1.30 µm ±0.15µm SPECIAL INSTRUCTIONS: Bond VCC First ADDITIONAL INFORMATION: Worst Case Current Density: <2.0 x 105 A/cm2 Transistor Count: 46 Metallization Mask Layout ACS05MS Y1 A1 VCC A6 A2 (3) Y2 (4) NC A3 (5) (12) Y6 (11) A5 NC (10) Y5 (6) (7) (8) (9) A4 Y4 GND Y3 (2) (1) (14) (13) ACS05MS |
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