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| ISL8394 |
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 INTERSIL
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3 page 
3 Absolute Maximum Ratings Thermal Information V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to15V V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to15V V- to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -15 to 0.3V All Other Pins (Note 2) . . . . . . . . . . . . . ((V-) - 0.3V) to ((V+) + 0.3V) Continuous Current (Any Terminal) . . . . . . . . . . . . . . . . . . . . . 30mA Peak Current, IN, NO, NC, or COM (Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . 100mA ESD Rating (Per MIL-STD-883 Method 3015). . . . . . . . . . . . . .>2kV Operating Conditions Temperature Range ISL8394IX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC Thermal Resistance (Typical, Note 3) θJA (oC/W) 20 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 95 Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC Moisture Sensitivity (See Technical Brief TB363) SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1 Maximum Storage Temperature Range. . . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC (Lead Tips Only) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 2. Signals on NC, NO, COM, or IN exceeding V+ or V- are clamped by internal diodes. Limit forward diode current to maximum current ratings. 3. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Electrical Specifications: ±5V Supply Test Conditions: VSUPPLY = ±4.5V to ±5.5V, GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 4), Unless Otherwise Specified PARAMETER TEST CONDITIONS TEMP (oC) (NOTE 5) MIN TYP (NOTE 5) MAX UNITS ANALOG SWITCH CHARACTERISTICS Analog Signal Range, VANALOG Full V- - V+ V ON Resistance, RON VS = ±4.5V, ICOM = 10mA, VNO or VNC = ±3.5V, (See Figure 5) 25 - 17 35 Ω Full - - 45 Ω RON Matching Between Channels, ∆R ON VS = ±5V, ICOM = 10mA, VNO or VNC = ±3V 25 - 0.5 2 Ω Full - - 4 Ω RON Flatness, RFLAT(ON) VS = ±5V, ICOM = 10mA, VNO or VNC = ±3V, 0V, (Note 7) 25 - - 4 Ω Full - - 6 Ω NO or NC OFF Leakage Current, INO(OFF) or INC(OFF) VS = ±5.5V, VCOM = ±4.5V, VNO or VNC = +4.5V, (Note 6) 25 -0.2 - 0.2 nA Full -2.5 - 2.5 nA COM ON Leakage Current, ICOM(ON) VS = ±5.5V, VCOM = VNO or VNC = ±4.5V, (Note 6) 25 -0.4 - 0.4 nA Full -5 - 5 nA DIGITAL INPUT CHARACTERISTICS Input Voltage High, VINH Full 2.4 - - V Input Voltage Low, VINL Full - - 0.8 V Input Current, IINH, IINL VS = ±5.5V, VIN = 0V or V+ Full -1 1 µA DYNAMIC CHARACTERISTICS Turn-ON Time, tON VS = ±4.5V, VNO or VNC = ±3V, RL = 300Ω, CL = 35pF, VIN = 0 to 3V, (See Figure 1) 25 - 50 130 ns Full - - 175 ns Turn-OFF Time, tOFF VS = ±4.5V, VNO or VNC = ±3V, RL = 300Ω, CL = 35pF, VIN = 0 to 3V, (See Figure 1) 25 - 30 75 ns Full - - 100 ns Break-Before-Make Time Delay, tD VS = ±5.5V, VNO or VNC = 3V, RL = 300Ω, CL = 35pF, VIN = 0 to 3V, (See Figure 3) 25 2 10 - ns Charge Injection, Q CL = 1.0nF, VG = 0V, RG = 0Ω, (See Figure 2) 25 - 5 10 pC NO OFF Capacitance, COFF f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 7) 25 - 12 - pF ISL8394 |
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