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IRF2805SPBF Datasheet(PDF) 1 Page - International Rectifier

No. de pieza IRF2805SPBF
Descripción Electrónicos  Advanced Process Technology
Download  11 Pages
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Fabricante Electrónico  IRF [International Rectifier]
Página de inicio  http://www.irf.com
Logo IRF - International Rectifier

IRF2805SPBF Datasheet(HTML) 1 Page - International Rectifier

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Parameter
Max.
Units
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V
135
†
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V
96
†
A
IDM
Pulsed Drain Current

700
PD @TC = 25°C
Power Dissipation
200
W
Linear Derating Factor
1.3
W/°C
VGS
Gate-to-Source Voltage
± 20
V
EAS
Single Pulse Avalanche Energy
‚
380
mJ
EAS (6 sigma)
Single Pulse Avalanche Energy Tested Value
ˆ
1220
IAR
Avalanche Current

See Fig.12a, 12b, 15, 16
A
EAR
Repetitive Avalanche Energy
‡
mJ
dv/dt
Peak Diode Recovery dv/dt
ƒ
2.0
V/ns
TJ
Operating Junction and
-55 to + 175
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
300 (1.6mm from case )
°C
HEXFET® Power MOSFET
Absolute Maximum Ratings
VDSS = 55V
RDS(on) = 4.7mΩ
ID = 135A
†
07/22/10
www.irf.com
1
HEXFET(R) is a registered trademark of International Rectifier.
Description
This HEXFET® Power MOSFET utilizes the latest
processing techniques to achieve extremely low on-
resistance per silicon area. Additional features of this
product are a 175°C junction operating temperature,
fastswitchingspeedandimprovedrepetitiveavalanche
rating . These features combine to make this design
an extremely efficient and reliable device for use in a
wide variety of applications.
S
D
G
Typical Applications
l
Industrial Motor Drive
IRF2805SPbF
IRF2805LPbF
D2Pak
IRF2805SPbF
TO-262
IRF2805LPbF
Thermal Resistance
Parameter
Typ.
Max.
Units
RθJC
Junction-to-Case
–––
0.75
RθJA
Junction-to-Ambient(PCB Mounted, steady state)**
–––
40
°C/W
Features
l
Advanced Process Technology
l
Ultra Low On-Resistance
l
175°C Operating Temperature
l
Fast Switching
l
Repetitive Avalanche Allowed up to Tjmax
l
Lead-Free
PD - 95944A


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