IRF6631PBF_15 datasheet(3/10 Pages) IRF

No. de pieza	IRF6631PBF

Descripción Electrónicos	Low Switching and Conduction Losses

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Fabricante Electrónico	IRF [International Rectifier]

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IRF6631PbF

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3

Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient

1E-006

1E-005

0.0001

0.001

0.01

0.1

1

10

100

t1 , Rectangular Pulse Duration (sec)

0.001

0.01

0.1

1

10

100

0.20

0.10

D = 0.50

0.02

0.01

0.05

SINGLE PULSE

( THERMAL RESPONSE )

Notes:

1. Duty Factor D = t1/t2

2. Peak Tj = P dm x Zthja + Tc

Ri (°C/W)

τi (sec)

1.6195

0.000126

2.14056

0.001354

22.2887

0.375850

20.0457

7.41

11.9144

99

τ

J

τ

J

τ

1

τ

1

τ

2

τ

2

τ

3

τ

3

R

1

R

1

R

2

R

2

R

3

R

3

Ci=

τi/Ri

Ci=

τi/Ri

τ

4

τ

4

R

4

R

4

τ

A

τ

A

τ

5

τ

5

R

5

R

5

Used double sided cooling , mounting pad.

Mounted on minimum footprint full size board with metalized

back and with small clip heatsink.

Notes:

Rθ is measured at TJ of approximately 90°C.

Surface mounted on 1 in. square Cu

(still air).

Mounted to a PCB with

small clip heatsink (still air)

Mounted on minimum

footprint full size board with

metalized back and with small

clip heatsink (still air)

Absolute Maximum Ratings

Parameter

Units

PD @TA = 25°C

Power Dissipation

e

W

PD @TA = 70°C

Power Dissipation

e

PD @TC = 25°C

Power Dissipation

f

TP

Peak Soldering Temperature

°C

TJ

Operating Junction and

TSTG

Storage Temperature Range

Thermal Resistance

Parameter

Typ.

Max.

Units

RθJA

Junction-to-Ambient

em

–––

58

RθJA

Junction-to-Ambient

km

12.5

–––

RθJA

Junction-to-Ambient

lm

20

–––

°C/W

RθJC

Junction-to-Case

fm

–––

3.0

RθJ-PCB

Junction-to-PCB Mounted

1.4

–––

Linear Derating Factor

eÃ

W/°C

1.4

0.017

270

-40 to + 150

Max.

42

2.2

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