TCA62723FMG

2010-06-10

10

Notes on Contents

1. Block Diagrams

Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory

purposes.

2. Equivalent Circuits

The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.

3. Timing Charts

Timing charts may be simplified for explanatory purposes.

4. Application Circuits

The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is

required, especially at the mass production design stage.

Toshiba does not grant any license to any industrial property rights by providing these examples of application

circuits.

5. Test Circuits

Components in the test circuits are used only to obtain and confirm the device characteristics. These components

and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.

IC Usage Considerations

Notes on handling of ICs

[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for

a moment. Do not exceed any of these ratings.

Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by

explosion or combustion.

[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over

current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute

maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or

load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the

effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time

and insertion circuit location, are required.

[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to

prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or

the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury,

smoke or ignition.

Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection

function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.

[4] Do not insert devices in the wrong orientation or incorrectly.

Make sure that the positive and negative terminals of power supplies are connected properly.

Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the

rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or

combustion.

In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly

even just one time.

[5] Carefully select external components (such as inputs and negative feedback capacitors) and load components

(such as speakers), for example, power amp and regulator.

If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC

voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent

or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In

particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC

voltage to a speaker directly.