The leadless chip carrier (LCC) package represents the

logical next step in the continual evolution of surface

mount technology. Desinged to be a close replacement

for the TO-39 package, the LCC will give designers the

extra flexibility they need to increase circuit board density.

International Rectifier has engineered the LCC package

to meet the specific needs of the power market by

increasing the size of the bottom source pad, thereby

enhancing the thermal and electrical performance. The

lid of the package is grounded to the source to reduce

RF interference.

01/27/15

www.irf.com

1

LCC-18

Product Summary

Part Number

IRFE230

200V

0.40

Ω

5.5A

Features:

For footnotes refer to the last page

REPETITIVE AVALANCHE AND dv/dt RATED

JANTX2N6798U

HEXFET

JANTXV2N6798U

SURFACE MOUNT (LCC-18)

REF:MIL-PRF-19500/557

IRFE230

200V, N-CHANNEL

Method 1020

Absolute Maximum Ratings

Parameter

Units

ID @ VGS = 10V, TC = 25°C Continuous Drain Current

5.5

ID @ VGS = 10V, TC = 100°C Continuous Drain Current

3.5

IDM

Pulsed Drain Current

À

22

PD @ TC = 25°C

Max. Power Dissipation

25

W

Linear Derating Factor

0.20

W/°C

VGS

Gate-to-Source Voltage

±20

V

EAS

Single Pulse Avalanche Energy

Á

110

mJ

IAR

Avalanche Current

À

5.5

A

EAR

Repetitive Avalanche Energy

À

2.5

mJ

dv/dt

Peak Diode Recovery dv/dt

Â

6.3

V/ns

TJ

Operating Junction

-55 to 150

TSTG

Storage Temperature Range

°C

Pckg. Mounting Surface Temp.

300 (for 5 S)

Weight

0.42 (typical)

g

A

PD-91715C