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AMC1200BDUBR Datasheet(PDF) 4 Page - Texas Instruments

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No. de pieza AMC1200BDUBR
Descripción Electrónicos  AMC1200/B Fully-Differential Isolation Amplifier
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Fabricante Electrónico  TI [Texas Instruments]
Página de inicio  http://www.ti.com
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AMC1200BDUBR Datasheet(HTML) 4 Page - Texas Instruments

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AMC1200, AMC1200B
SBAS542D – APRIL 2011 – REVISED JULY 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
Over the operating ambient temperature range, unless otherwise noted.
(1)
MIN
MAX
UNIT
Supply voltage, VDD1 to GND1 or VDD2 to GND2
–0.5
6
V
Analog input voltage at VINP, VINN
GND1 – 0.5
VDD1 + 0.5
V
Input current to any pin except supply pins
–10
10
mA
Maximum junction temperature, TJ Max
150
°C
Storage Temperature, Tstg
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute
maximum rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM) JEDEC standard 22, test method A114-
±2500
C.01(1)
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
±1000
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
TA
Operating ambient temperature range
–40
105
°C
VDD1
High-side power supply
4.5
5
5.5
V
VDD2
Low-side power supply
2.7
5
5.5
V
6.4 Thermal Information
AMC1200, AMC1200B
THERMAL METRIC(1)
DUB (SOP)
DWV (SOIC)
UNIT
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
75.1
102.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
61.6
49.8
°C/W
RθJB
Junction-to-board thermal resistance
39.8
56.6
°C/W
ψJT
Junction-to-top characterization parameter
27.2
16
°C/W
ψJB
Junction-to-board characterization parameter
39.4
55.2
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 2011–2015, Texas Instruments Incorporated
Product Folder Links: AMC1200 AMC1200B


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