LDC1000-Q1

SLOS886B – SEPTEMBER 2014 – REVISED OCTOBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Analog supply voltage

5.5

V

IO supply voltage

VIO – GND

5.5

V

Voltage

On any pin

–0.3

V

On any digital pin

–0.3

V

Input Current

INA and INB

8

mA

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

–2000

2000

Electrostatic discharge

V

Charged device model (CDM), per AEC Q100-011, all pins

–1000

1000

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

4.75

5.25

V

IO supply voltage (VIO – GND)

1.8

5.25

V

≥0

V

Operating temperature (see the Mechanical,

Grade 0 (temperature range E)

–40

150

Packaging, and Orderable Information section for

°C

Grade 1 (temperature range Q)

–40

125

package options)

6.4 Thermal Information

PW

UNIT

16 PINS

Junction-to-ambient thermal resistance

106.3

Junction-to-case (top) thermal resistance

40.8

Junction-to-board thermal resistance

51.3

°C/W

Junction-to-top characterization parameter

3.6

Junction-to-board characterization parameter

50.8

Junction-to-case (bottom) thermal resistance

—

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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