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TPL0102-EP Datasheet(PDF) 5 Page - Texas Instruments

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No. de pieza TPL0102-EP
Descripción Electrónicos  TPL0102-EP 256-Taps Dual-Channel Digital Potentiometer With Non-Volatile Memory
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TPL0102-EP Datasheet(HTML) 5 Page - Texas Instruments

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TPL0102-EP
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SLIS149 – JUNE 2014
7.4 Thermal Information
TPL0102-EP
THERMAL METRIC(1)
PW
UNIT
14 PINS
RθJA
Junction-to-ambient thermal resistance(2)
112.9
RθJC(top)
Junction-to-case (top) thermal resistance(3)
39.9
RθJB
Junction-to-board thermal resistance(4)
55.9
°C/W
ψJT
Junction-to-top characterization parameter(5)
3.5
ψJB
Junction-to-board characterization parameter(6)
55.2
RθJC(bot)
Junction-to-case (bottom) thermal resistance(7)
N/A
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3)
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4)
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5)
The junction-to-top characterization parameter,
ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining
θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6)
The junction-to-board characterization parameter,
ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining
θJA , using a procedure described in JESD51-2a (sections 6 and 7).
(7)
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
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