BUK662R5-30C

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 2 — 14 October 2010

10 of 14

NXP Semiconductors

BUK662R5-30C

N-channel TrenchMOS intermediate level FET

7.

Package outline

Fig 17. Package outline SOT404 (D2PAK)

UNIT

A

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

A1

D1

D

max.

E

eLp

HD

Q

c

2.54

2.60

2.20

15.80

14.80

2.90

2.10

11

1.60

1.20

10.30

9.70

4.50

4.10

1.40

1.27

0.85

0.60

0.64

0.46

b

DIMENSIONS (mm are the original dimensions)

SOT404

0

2.5

5 mm

scale

Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped)

SOT404

e

e

E

b

D1

HD

D

Q

Lp

c

A1

A

13

2

mounting

base

05-02-11

06-03-16