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TC1185 Datasheet(PDF) 4 Page - Microchip Technology |
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TC1185 Datasheet(HTML) 4 Page - Microchip Technology |
4 / 20 page TC1014/TC1015/TC1185 DS21335B-page 4 © 2002 Microchip Technology Inc. TC1014/TC1015/TC1185 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: VIN =VR +1V, IL =100µA, CL =3.3µF, SHDN >VIH,TA = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Symbol Parameter Min Typ Max Units Test Conditions SHDN Input VIH SHDN Input High Threshold 45 — — %VIN VIN =2.5V to6.5V VIL SHDN Input Low Threshold — — 15 %VIN VIN =2.5V to6.5V Note 1: The minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VR +VDROPOUT. 2: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V. 3: 4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. 6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. 7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA,TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details. 8: Apply for Junction Temperatures of -40°C to +85°C. TC VOUT =(VOUTMAX –VOUTMIN)x 10 6 VOUT x ∆T |
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Descripción similar - TC1185 |
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