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TC1187VCT Datasheet(PDF) 2 Page - Microchip Technology |
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TC1187VCT Datasheet(HTML) 2 Page - Microchip Technology |
2 / 16 page TC1070/TC1071/TC1187 DS21353B-page 2 © 2002 Microchip Technology Inc. 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings* Input Voltage .........................................................6.5V Output Voltage........................... (-0.3V) to (VIN +0.3V) Power Dissipation................Internally Limited (Note 5) Maximum Voltage on Any Pin ........ VIN +0.3V to -0.3V Operating Temperature Range...... -40°C < TJ <125°C Storage Temperature.......................... -65°C to +150°C *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC1070/TC1071/TC1187 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN =VOUT +1V, IL =0.1mA,CL =3.3µF, SHDN >VIH,TA = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Symbol Parameter Min Typ Max Units Test Conditions VIN Input Operating Voltage 2.7 — 6.0 V Note 6 IOUTMAX Maximum Output Current 50 100 150 — — — — — — mA TC1070 TC1071 TC1187 VOUT Adjustable Output Voltage Range VREF —5.5 V VREF Reference Voltage 1.165 1.20 1.235 V ∆VREF/∆TVREF Temperature Coefficient — 40 —ppm/°C Note 1 ∆VOUT/∆VIN Line Regulation — 0.05 0.35 %(VR +1V) ≤ VIN ≤ 6V ∆V OUT/VOUT Load Regulation TC1070; TC1071 TC1187 — — 0.5 0.5 2 3 %IL = 0.1mA to IOUTMAX IL = 0.1mA to IOUTMAX (Note 2) VIN-VOUT Dropout Voltage TC1071; TC1187 TC1187 — — — — — 2 65 85 180 270 — — 120 250 400 mV IL =0.1mA IL =20mA IL =50mA IL = 100mA IL = 150mA (Note 3) IIN Supply Current — 50 80 µA SHDN =VIH,IL =0 IINSD Shutdown Supply Current — 0.05 0.5 µA SHDN =0V PSRR Power Supply Rejection Ratio — 64 — dB FRE ≤ 1kHz IOUTSC Output Short Circuit Current — 300 450 mA VOUT =0V ∆V OUT/∆PD Thermal Regulation — 0.04 — V/W Note 4 TSD Thermal Shutdown Die Temperature — 160 — °C ∆TSD Thermal Shutdown Hysteresis — 10 — °C eN Output Noise — 260 — nV/ √Hz IL =IOUT MAX Note 1: 2: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 3: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. 4: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. 5: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA,TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.. 6: The minimum VIN has to justify the conditions: VIN ≥ VR +VDROPOUT and VIN ≥ 2.7V for IL = 0.1mA to IOUTMAX. TC VOUT =(VOUTMAX –VOUTMIN)x 10 6 VOUT x ∆T |
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