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TC1174VUA Datasheet(PDF) 5 Page - Microchip Technology

No. de pieza TC1174VUA
Descripción Electrónicos  300mA CMOS LDO with Shutdown and VREF Bypass
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Fabricante Electrónico  MICROCHIP [Microchip Technology]
Página de inicio  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

TC1174VUA Datasheet(HTML) 5 Page - Microchip Technology

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© 2002 Microchip Technology Inc.
DS21363B-page 5
TC1174
4.0
THERMAL CONSIDERATIONS
4.1
Thermal Shutdown
Integrated
thermal
protection
circuitry
shuts
the
regulator off when die temperature exceeds 150°C.
The regulator remains off until the die temperature
drops to approximately 140°C.
4.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
EQUATION 4-1:
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(TAMAX), the maximum allowable die temperature
(TJMAX) and the thermal resistance from junction-to-air
(
θJA). The 8-Pin SOIC package has a θJA of approxi-
mately 160°C/Watt, while the 8-Pin MSOP package
has a
θJA of approximately 200°C/Watt.
EQUATION 4-2:
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
Given:
VINMAX
= 3.0V + 10%
VOUTMIN = 2.7V – 0.5%
ILOADMAX = 250mA
TJMAX
= 125°C
TAMAX
= 55°C
8-Pin MSOP Package
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD ≈ (VINMAX –VOUTMIN)ILOADMAX
= [(3.0 x 1.1) – (2.7 x .995)]250 x 10–3
=155mW
Maximum allowable power dissipation:
In this example, the TC1174 dissipates a maximum of
155mW; below the allowable limit of 350mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
VIN is found by substituting the maximum allowable
power dissipation of 350mW into Equation 4-1, from
which VINMAX =4.1V.
4.3
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower
θJA and therefore
increase the maximum allowable power dissipation
limit.
Where:
PD ≈ (VINMAX –VOUTMIN)ILOADMAX
PD
VINMAX
VOUTMIN
ILOADMAX
= Worst case actual power dissipation
= Minimum regulator output voltage
= Maximum output (load) current
= Maximum voltage on VIN
PDMAX =(TJMAX –TAMAX)
θJA
Where all terms are previously defined.
PDMAX =(TJMAX –TAMAX)
θJA
= (125 – 55)
200
= 350mW


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