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TPS3701 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS3701 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 27 page TPS3701 SBVS240 – NOVEMBER 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) Over operating junction temperature range, unless otherwise noted. VALUE MIN MAX UNIT VDD –0.3 +40 V Voltage(2) VOUTA, VOUTB –0.3 +28 V VINA, VINB –0.3 +7 V Current Output pin current 40 mA Temperature Operating junction, TJ –40 +125 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network ground terminal. 6.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –65 +150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all –2000 +2000 pins(1) V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification –500 +500 JESD22-C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating junction temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Supply pin voltage 1.8 36 V VINA, VINB Input pin voltage 0 1.7 V VOUTA, VOUTB Output pin voltage 0 25 V IOUTA, IOUTB Output pin current 0 10 mA TJ Junction temperature –40 +25 +125 °C 6.4 Thermal Information TPS3701 THERMAL METRIC(1) DDC (SOT) UNITS 6 PINS RθJA Junction-to-ambient thermal resistance 201.6 RθJC(top) Junction-to-case (top) thermal resistance 47.8 RθJB Junction-to-board thermal resistance 51.2 °C/W ψJT Junction-to-top characterization parameter 0.7 ψJB Junction-to-board characterization parameter 50.8 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: TPS3701 |
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