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LM2623 Datasheet(PDF) 4 Page - Texas Instruments |
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LM2623 Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 22 page  LM2623 SNVS188H – MAY 2004 – REVISED NOVEMBER 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) MIN MAX UNIT SW pin voltage –0.5 14.5 V BOOT, VDD, EN and FB pins –0.5 10 V FREQ pin 100 µA TJmax (3) 150 °C Lead temp. (soldering, 5 sec) 260 °C Power dissipation (TA=25°C) (3) 500 mW (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) The maximum power dissipation must be derated at elevated temperatures and is dictated by Tjmax (maximum junction temperature), RθJA (junction-to-ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is Pdmax = (Tjmax – TA)/ RθJA or the number given in the Absolute Maximum Ratings, whichever is lower. 6.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all 2 pins(1) V(ESD) Electrostatic discharge kV Charged device model (CDM), per JEDEC specification 0.5 JESD22-C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions (1) MIN MAX UNIT VDD pin 3 5 V FB, EN pins 0 VDD BOOT pin 0 10 V Ambient temperature (TA) −40 85 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.4 Thermal Information LM2623 THERMAL METRIC(1) NHE DGK UNIT 14 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 40 – 56 240 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2004–2014, Texas Instruments Incorporated Product Folder Links: LM2623 |
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