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LM2662 Datasheet(PDF) 4 Page - Texas Instruments |
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LM2662 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 25 page LM2662, LM2663 SNVS002E – JANUARY 1999 – REVISED OCTOBER 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Supply voltage (V+ to GND, or GND to OUT) 6 LV (OUT − 0.3 V) (GND + 3 V) V FC, OSC, SD The least negative of (OUT − 0.3 V) or (V+ − 6 V) to (V+ + 0.3 V) V+ and OUT continuous output current 250 Output short-circuit duration to GND(3) 1 sec. Power dissipation (TA = 25°C) (4) 735 mW TJ max (4) 150 Operating ambient temperature −40 85 °C Operating junction temperature −40 105 Lead temperature (soldering, 10 seconds) 300 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) OUT may be shorted to GND for one second without damage. However, shorting OUT to V+ may damage the device and should be avoided. Also, for temperatures above 85°C, OUT must not be shorted to GND or V+, or device may be damaged. (4) The maximum allowable power dissipation is calculated by using PDMax = (TJMax − TA)/RθJA, where TJMax is the maximum junction temperature, TA is the ambient temperature, and RθJA is the junction-to-ambient thermal resistance of the specified package. 6.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range −65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all 2000 V(ESD) Electrostatic discharge V pins(1) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT V+ (supply voltage) 2.5 5.5 V Junction temperature (TJ) –40 105 °C Ambient temperature (TJ) –40 85 6.4 Thermal Information LM2662 LM2663 THERMAL METRIC(1) SOIC (D) UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 170 170 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 1999–2014, Texas Instruments Incorporated Product Folder Links: LM2662 LM2663 |
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